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Wire bonding in microelectronics [electronic resource] : materials, processes, reliability, and yield / George G. Harmon.

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Series: Electronic packaging and interconnection seriesPublication details: New York : McGraw-Hill, c1997.Edition: 2nd edDescription: xiv, 290 p. : illSubject(s):

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Holdings: http://site.ebrary.com/lib/strathmore/Doc?id=10152784

Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.

Includes bibliographical references and index.

Electronic reproduction. Palo Alto, Calif. : ebrary, 2009. Available via World Wide Web. Access may be limited to ebrary affiliated libraries.

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