Wire bonding in microelectronics [electronic resource] : materials, processes, reliability, and yield /
Harman, George G.
Wire bonding in microelectronics materials, processes, reliability, and yield / [electronic resource] : George G. Harmon. - 2nd ed. - New York : McGraw-Hill, c1997. - xiv, 290 p. : ill. - Electronic packaging and interconnection series . - Electronic packaging and interconnection series. .
Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.
Includes bibliographical references and index.
Electronic reproduction.
Palo Alto, Calif. :
ebrary,
2009.
Available via World Wide Web.
Access may be limited to ebrary affiliated libraries.
Wire bonding (Electronic packaging)--Production control.
Electronic packaging--Reliability.
Electronic packaging--Defects.
Semiconductors--Failures.
Electronic books.
TK7836 / .H366 1997eb
621.3815
Wire bonding in microelectronics materials, processes, reliability, and yield / [electronic resource] : George G. Harmon. - 2nd ed. - New York : McGraw-Hill, c1997. - xiv, 290 p. : ill. - Electronic packaging and interconnection series . - Electronic packaging and interconnection series. .
Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.
Includes bibliographical references and index.
Electronic reproduction.
Palo Alto, Calif. :
ebrary,
2009.
Available via World Wide Web.
Access may be limited to ebrary affiliated libraries.
Wire bonding (Electronic packaging)--Production control.
Electronic packaging--Reliability.
Electronic packaging--Defects.
Semiconductors--Failures.
Electronic books.
TK7836 / .H366 1997eb
621.3815