| 000 | 01931nam a2200373Ia 4500 | ||
|---|---|---|---|
| 001 | ebr10320212 | ||
| 003 | CaPaEBR | ||
| 005 | 20260707180113.0 | ||
| 006 | m u | ||
| 007 | cr cn||||||||| | ||
| 008 | 080814s2008 ohua sb 001 0 eng d | ||
| 020 | _z0871707144 | ||
| 020 | _z9780871707147 | ||
| 040 |
_aCaPaEBR _cCaPaEBR |
||
| 035 | _a(OCoLC)647827998 | ||
| 050 | 1 | 4 |
_aTK7871 _b.I68 2008eb |
| 090 |
_c102400 _d82277 |
||
| 111 | 2 |
_aInternational Symposium for Testing and Failure Analysis _n(34th : _d2008 : _cPortland, Or.) _9143761 |
|
| 245 | 1 | 0 |
_aISTFA 2008 _h[electronic resource] : _bconference proceedings from the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA / _csponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2008, ASM International. |
| 246 | 3 | 0 | _aProceedings of the 34th International Symposium for Testing and Failure Analysis |
| 246 | 3 | 0 | _a34th International Symposium for Testing and Failure Analysis |
| 246 | 3 | _aThirty-fourth International Symposium for Testing and Failure Analysis | |
| 260 |
_aMaterials Park, OH : _bAsm International, _cc2008. |
||
| 300 |
_axx, 528 p. : _bill. |
||
| 504 | _aIncludes bibliographical references and index. | ||
| 533 |
_aElectronic reproduction. _bPalo Alto, Calif. : _cebrary, _d2009. _nAvailable via World Wide Web. _nAccess may be limited to ebrary affiliated libraries. |
||
| 650 | 0 |
_aElectronics _xMaterials _xTesting _vCongresses. _9143762 |
|
| 650 | 0 |
_aElectronic apparatus and appliances _xTesting _vCongresses. _9143763 |
|
| 655 | 7 |
_aElectronic books. _2local _9190 |
|
| 710 | 2 |
_aASM International. _9143764 |
|
| 710 | 2 |
_aElectronic Device Failure Analysis Society. _9143765 |
|
| 710 | 2 |
_aebrary, Inc. _9191 |
|
| 856 | 4 | 0 |
_uhttp://site.ebrary.com/lib/strathmore/Doc?id=10320212 _zAn electronic book accessible through the World Wide Web; click to view |
| 999 |
_c102400 _d82277 |
||