01931nam a2200373Ia 4500001001200000003000800012005001700020006001900037007001500056008004100071020001500112020001800127040002100145035002100166050002400187090001800211111010200229245030200331246008500633246006600718246007500784260005300859300002300912504005100935533015200986650005701138650007001195655003401265710003101299710005601330710002201386856013101408999001801539ebr10320212CaPaEBR20260707180113.0m        u        cr cn|||||||||080814s2008    ohua    sb    001 0 eng d  z0871707144  z9780871707147  aCaPaEBRcCaPaEBR  a(OCoLC)64782799814aTK7871b.I68 2008eb  c102400d822772 aInternational Symposium for Testing and Failure Analysisn(34th :d2008 :cPortland, Or.)914376110aISTFA 2008h[electronic resource] :bconference proceedings from the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA /csponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2008, ASM International.30aProceedings of the 34th International Symposium for Testing and Failure Analysis30a34th International Symposium for Testing and Failure Analysis3 aThirty-fourth International Symposium for Testing and Failure Analysis  aMaterials Park, OH :bAsm International,cc2008.  axx, 528 p. :bill.  aIncludes bibliographical references and index.  aElectronic reproduction.bPalo Alto, Calif. :cebrary,d2009.nAvailable via World Wide Web.nAccess may be limited to ebrary affiliated libraries. 0aElectronicsxMaterialsxTestingvCongresses.9143762 0aElectronic apparatus and appliancesxTestingvCongresses.9143763 7aElectronic books.2local91902 aASM International.91437642 aElectronic Device Failure Analysis Society.91437652 aebrary, Inc.919140uhttp://site.ebrary.com/lib/strathmore/Doc?id=10320212zAn electronic book accessible through the World Wide Web; click to view  c102400d82277